RO4003C PCB: 4-Layer, 90° Countersunk Holes, ENIG Finish
(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
Overview of RO4003C 4-Layer PCB
The RO4003C PCB is a high-performance 4-layer rigid PCB designed for RF, microwave, and multilayer applications requiring tight dielectric control, low loss, and excellent mechanical stability. Manufactured with Rogers RO4003C laminates, this PCB features a finished thickness of 4.8mm, countersunk holes, and a via-filled resin and capped surface.
The Electroless Nickel Immersion Gold (ENIG) surface finish provides superior solderability, corrosion resistance, and long-term durability, while the black silkscreen adds a sleek, professional finish. With a dielectric constant (Dk) of 3.38 ± 0.05 at 10 GHz, this PCB is ideal for performance-sensitive, high-frequency designs.
PCB Construction Details
| Parameter | Specification |
| Base Material | Rogers RO4003C |
| Layer Count | 4 layers |
| Board Dimensions | 60mm x 60mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | None |
| Finished Thickness | 4.8mm |
| Copper Weight | 1oz (1.4 mils) inner and outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | Black |
| Bottom Silkscreen | None |
| Top Solder Mask | None |
| Bottom Solder Mask | None |
| Countersunk Holes | Conical, 90° |
| Via Filling | Resin-filled and capped |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | Rogers RO4003C Core | 0.508mm (20mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
| Prepreg | RO4450F × 2 | 0.204mm |
| Dielectric Layer | Rogers RO4003C Core | 1.524mm (60mil) |
| Prepreg | RO4450F × 2 | 0.204mm |
| Dielectric Layer | Rogers RO4003C Core | 1.524mm (60mil) |
| Prepreg | RO4450F × 2 | 0.204mm |
| Copper Layer 3 | Copper (1oz) | 35μm |
| Dielectric Layer | Rogers RO4003C Core | 0.508mm (20mil) |
| Copper Layer 4 | Copper (1oz) | 35μm |
Introduction to RO4003C Material
The Rogers RO4003C laminates are woven glass-reinforced hydrocarbon/ceramic composites that combine the electrical performance of PTFE-based materials with the mechanical stability and manufacturability of epoxy/glass laminates. These laminates offer tight dielectric control, low loss, and high thermal stability, making them a cost-effective alternative to expensive PTFE materials.
Key Features of RO4003C
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz for consistent performance.
- Dissipation Factor: Low at 0.0027 at 10 GHz, reducing signal loss.
- Thermal Conductivity: 0.71 W/mK for efficient heat dissipation.
- Thermal Expansion Coefficient (CTE): X-axis: 11 ppm/°C. Y-axis: 14 ppm/°C. Z-axis: 46 ppm/°C.
- Moisture Absorption: Low at 0.06%.
- Tg: >280°C for stability under high temperatures.
Benefits of RO4003C
- Cost-Effective: Processes like FR-4 at a lower cost than PTFE laminates.
- Dimensional Stability: Excellent for multilayer boards with mixed dielectrics.
- Low Loss: Superior performance in high-frequency applications.
- Thermal Stability: Reliable through severe thermal shocks and processing.
Applications
Cellular Base Station Antennas and Power Amplifiers
Automotive Radar and Sensors
RF Identification Tags (RFID)
LNBs for Direct Broadcast Satellites
Microwave and RF Circuits
Conclusion
The RO4003C 4-layer PCB is a premium, cost-effective solution for high-frequency multilayer designs. With its 4.8mm thickness, resin-filled capped vias, and 90° countersunk holes, this PCB is tailored for precision RF applications requiring dimensional stability, low loss, and mechanical durability.
Compliant with IPC-Class-2 standards and available worldwide, the RO4003C PCB is the perfect choice for engineers designing telecom infrastructure, automotive radar systems, and satellite communication components.
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Rogers RO4003C hybrid 4-Layer RF PCB built on 0.508 mm (20mil) substrate with Countersunk Holes | ENIG Finish Images
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