6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask
Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB
The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.
This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.
PCB Construction Details
The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:
| Parameter | Specification |
| Base Material | RO4003C / Tg170 FR-4 |
| Layer Count | 6 Layers |
| Board Dimensions | 495mm x 345mm ± 0.15mm |
| Minimum Trace/Space | 5/6 mils |
| Minimum Hole Size | 0.8mm |
| Blind Vias | No |
| Finished Thickness | 6.8mm |
| Copper Weight | 1oz (1.4 mils) outer & inner layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Depth-Controlled Slots | Top and Bottom Layers |
| Electrical Testing | 100% tested prior to shipment |
PCB Stackup
The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35 μm |
| Core Material | Tg170 FR-4 Core | 3.0mm |
| Copper Layer 2 | Copper (1oz) | 35 μm |
| Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
| Copper Layer 3 | Copper (1oz) | 35 μm |
| Core Material | Rogers RO4003C Core | 0.305mm |
| Copper Layer 4 | Copper (1oz) | 35 μm |
| Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
| Copper Layer 5 | Copper (1oz) | 35 μm |
| Core Material | Tg170 FR-4 Core | 3.0mm |
| Copper Layer 6 | Copper (1oz) | 35 μm |
PCB Statistics
The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:
- Components: 132
- Total Pads: 456
- Thru Hole Pads: 271
- Top SMT Pads: 166
- Bottom SMT Pads: 19
- Vias: 131
- Nets: 17
Introduction to RO4003C
The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.
Key features of RO4003C include:
- Low moisture absorption (0.06%) for reliable performance in humid environments.
- Stable thermal expansion (CTE), ensuring excellent dimensional stability.
- High thermal conductivity (0.71 W/m/K) for effective heat dissipation.
Applications
This PCB is ideal for applications requiring high-frequency stability and reliability, such as:
- Cellular Base Station Antennas
- Automotive Radar and Sensors
- RF Identification Tags
- LNBs for Direct Broadcast Satellites
With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.
|
|
6-Layer RO4003C/Tg170 FR-4 PCB with 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask Images
|
